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Heat dissipation sheet - メーカー・企業19社の製品一覧とランキング

更新日: 集計期間:Sep 10, 2025~Oct 07, 2025
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Heat dissipation sheetのメーカー・企業ランキング

更新日: 集計期間:Sep 10, 2025~Oct 07, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Ally Japan 横浜本社 Kanagawa//Electronic Components and Semiconductors
  2. 宝永ゴム Osaka//Resin/Plastic
  3. ショウワ Osaka//Manufacturing and processing contract
  4. 4 ワイドワーク Tokyo//Industrial Electrical Equipment
  5. 5 五洋紙工 Osaka//Resin/Plastic

Heat dissipation sheetの製品ランキング

更新日: 集計期間:Sep 10, 2025~Oct 07, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. ☆Free sample available☆ Flexible heat dissipation sheet <HXXX series> Ally Japan 横浜本社
  2. Heat dissipation sheet 宝永ゴム
  3. Heat-dissipating sheet Acrylicool TM <prototype> 五洋紙工
  4. 4 Heat dissipation sheet, heat dissipation rubber (TIM material) ショウワ
  5. 5 "Super" high thermal conductivity heat dissipation sheet Thermo-TranzM50α ワイドワーク

Heat dissipation sheetの製品一覧

1~15 件を表示 / 全 31 件

表示件数

Silicone-free heat dissipation sheet "Efco TM Sheet"

High-performance thermal conductive sheet that prevents the generation of low molecular weight siloxanes and prevents issues such as contact failure.

The "Efco TM Sheet" is a high-performance heat dissipation sheet made from materials such as acrylic rubber and TPE (thermoplastic elastomer). It does not generate low molecular weight siloxanes, preventing issues such as contact failure. All products comply with RoHS regulations and do not contain harmful substances such as halogens, lead, or fluorocarbons. 【Features】 ■ Siloxane-free ■ Environmentally friendly ■ Low VOC (volatile organic compounds) *For more details, please refer to the PDF materials or feel free to contact us.

  • Other consumables

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"Super" high thermal conductivity heat dissipation sheet Thermo-TranzM50α

A high heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion of polymers.

It is used by placing it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● A high thermal conductivity sheet made in Japan, unlike any other. ● A heat dissipation sheet that maintains both flexibility and adhesion. ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs. ● Operating temperature range is from -40°C to 150°C, and it is resistant to heat cycles. ● Excellent handling properties.

  • Other electronic parts

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Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzUTW

A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.

It is used by inserting it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● High thermal conductivity sheet made in Japan ● The low molecular siloxane content is kept below 70 ppm, allowing for use near contacts such as switches. ● It has a type that retains polymer-derived adhesiveness, providing double-sided adhesion, making it a high thermal conductivity sheet with excellent fixation and followability. The presence of some adhesive on both sides enhances adhesive performance and makes handling easy. (The adhesive strength is strong.) ● A heat dissipation sheet that maintains a balance of flexibility and adhesion ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs. ● The operating temperature range is -40°C to 150°C, and it is a sheet that is also resistant to heat cycles.

  • Other electronic parts
  • Other polymer materials

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Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzVW

A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.

It is used by placing it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● High thermal conductivity sheet made in Japan ● Enables cooling of high heat-generating areas such as CPUs, GPUs, and high energy density LEDs, while keeping the low molecular siloxane content below 70 ppm, making it suitable for use near contacts like switches. ● It is a type that provides double-sided adhesion by retaining polymer-derived stickiness, resulting in a high thermal conductivity sheet with excellent fixation and followability. The presence of some adhesive on both sides increases adhesive performance and makes handling easy. (The adhesive strength is strong.) ● A heat dissipation sheet that maintains both flexibility and adhesion ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high energy density LEDs. ● The operating temperature range is from -40°C to 150°C, and it is a sheet that is also resistant to heat cycles.

  • Other electronic parts
  • Other polymer materials

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Sekisui Chemical Co., Ltd. APCS Exhibition Information

Exhibiting at APCS (Advanced Packaging and Chiplet Summit)!

Sekisui Chemical Co., Ltd. will exhibit at the APCS (Advanced Packaging and Chiplet Summit) held from December 14 to December 16. December 14 (Wednesday) - 16 (Friday) 10:00-17:00 at Tokyo Big Sight (East Halls 1, 2, 3) Sekisui Chemical Co., Ltd. exhibition area: East Hall 3 side (3850) Sekisui Chemical offers a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor backend processes and various substrates (PCB, FPC, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High-adhesion, easy-peel UV tape SELFA - High thermal conductivity heat dissipation sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.

  • Plastic utensils and containers

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Insulating and heat-dissipating material, insulating and heat-dissipating sheet.

Excellent mechanical durability and penetration resistance! High electrical durability!

Insulating and Heat Dissipating Materials: Insulating and heat dissipating sheets are designed to achieve the required insulating and heat dissipating properties for applications at a low cost. Additionally, they are reinforced with a fiberglass cloth layer, enhancing their strength against breakage, penetration, and bending. The products are available in rolls or die-cut shapes. Optionally, adhesive tape can be added to one or both sides. Due to their long product lifespan, they are adopted in many fields, including the automotive and electronics industries. For more details, please contact us or refer to the catalog.

  • Composite Materials

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Graphene heat dissipation material "Graphene Flower SP"

A quarter the weight of copper! It has high heat dissipation performance that balances high thermal conductivity and thickness.

The "Graphene Flower SP" has high heat dissipation performance that balances high thermal conductivity and thickness. It is 1/4 the weight of copper (density 2.2g/cm3) and allows for control of the direction of thermal conductivity. Additionally, compared to conventional thin graphite, it achieves extremely high heat dissipation performance due to the effect of thickness. 【Features】 ■ High heat dissipation performance that balances high thermal conductivity and thickness ■ 1/4 the weight of copper (density 2.2g/cm2) ■ Directional control of thermal conductivity is possible ■ Extremely high heat dissipation performance can be achieved due to the effect of thickness *For more details, please refer to the PDF document or feel free to contact us.

  • others

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【Heat Dissipation Sheet】 High thermal conductivity, noise reduction, silicone-free, etc.

We handle a wide range of thermal conductivity materials and heat dissipation sheets that can absorb electromagnetic waves, and we will propose suitable materials based on your desired specifications. *Samples are available upon request.

Our company purchases a wide variety of thermal conductive sheets from multiple manufacturers and processes suitable materials according to our customers' needs. If you are having trouble with shape processing, whether you are an end user or a material manufacturer, please feel free to contact us. 【Thermal Conductive Sheets We Handle】*Partial Excerpt ■ Thermal conductive sheets with thermal conductivity in the vertical direction (thickness direction) ■ Thermal conductive sheets with high thermal conductivity of "30 W/m·K" or more ■ Thermal conductive sheets that can counteract noise ■ Silicone-free thermal conductive sheets ★ If you would like a sample, please request it through the inquiry form. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Heat dissipation sheet COH series

Taika Sheet-type Thermal Conductive Gel λ (Lambda) Gel COH Series

It is a sheet-type heat dissipation material that is placed in the gaps between heating elements and cooling components such as heat sinks to eliminate air pockets.

  • Other polymer materials
  • Other electronic parts

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High-reliability thermal conductive resin "Thermo Rubber (R)"

Extremely high flexibility and high-reliability thermal conductive resin that combines insulation and thermal conductivity!

"Thermal Rubber (R)" is a highly reliable thermal conductive resin that absorbs stress generated between materials with different thermal expansion coefficients, enhancing the reliability of the product. It conforms to surface irregularities, adheres closely, and quickly dissipates heat from the heating element to the heat dissipation (housing) area. Additionally, by incorporating a special filler and dispersing it uniformly, we have achieved a high thermal conductivity. [Features] - High flexibility - High thermal conductivity - High compressibility - Stress absorption, etc. *For more details, please download the PDF or feel free to contact us.

  • glue

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Graphene TEM grid

By applying hydrophilic treatment, a very thin and uniform layer of ice can be formed!

This product is a groundbreaking TEM grid made of high-purity CVD-synthesized two-layer graphene self-supporting film. It is suitable as a sample support film for transmission electron microscopy observation of ultrafine particles and viruses. By applying hydrophilization treatment, it can form a very thin and uniform layer of ice. Additionally, hydrophilized graphene TEM grids are also available. 【Features】 - Groundbreaking TEM grid made of high-purity CVD-synthesized two-layer graphene self-supporting film - Suitable as a sample support film for transmission electron microscopy observation of ultrafine particles and viruses - Can form a very thin and uniform layer of ice through hydrophilization treatment - Hydrophilized graphene TEM grids are also available *For more details, please refer to the PDF document or feel free to contact us.

  • others

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Repoly Super Low Oil Bleed Ultra Soft Heat Dissipation Sheet AS Series

An ultra-soft heat dissipation sheet that has no oil bleed even in a highly compressed state. UL flame retardant and RoHS compliant. [Catalog available]

AS200/AS400 is a gap-filling material with a high thermal conductivity of 2.0/40W/m*K. Due to its high flexibility, high compressibility, and resistance to oil bleed, the amount of oil bleed is extremely low even under high compression conditions. 【Features】 ◆ Oil contamination and appearance dirt caused by oil bleed and the adhesion of dust to electronic devices can be avoided. ◆ UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • plastic
  • Composite Materials

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Repoly high-compression non-silicone heat dissipation sheet Repoly N700

It is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials, and the volatile substances due to heating are extremely low compared to acrylic-based materials.

◆This is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials. It has a high thermal conductivity (1.5/3.0 W/mK). ◆The thermal resistance value of the material itself is lower than that of acrylic-based materials, allowing for faster heat conduction. ◆Not only does it have minimal volatile substances due to heating, but it also has significantly fewer compared to acrylic-based materials. ◆Due to the use of high compressibility technology, the force required for compression is extremely small, and the wide heat dissipation area allows for faster heat conduction. ◆It has a double-sided mild adhesive property, excellent adhesion, and is convenient to work with. ◆Since mold shaping is done in-house, we can accommodate detailed specifications for sheet shapes, mold shaping, and cutting. ◆UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials

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Graphene heat dissipation material "Graphene Flower SP"

This is a high-performance heat sink that achieves both high thermal conductivity and thickness. The direction of heat conduction can be controlled either in the plane direction or in the vertical (thickness) direction.

This is a heat dissipation plate made from high-oriented graphite, which has been graphitized using a unique molding technology with graphene as the raw material, and can be cut to any thickness. It has a thermal conductivity of over twice that of copper (700-1000 W/m·K), is lightweight with a bulk density of one-fourth that of copper (2.2 g/cm³), and excels in sound wave permeability. You can choose between the XY type with high thermal conductivity in the plane direction and the XZ type with high thermal conductivity in the vertical (thickness) direction. Its machinability is the same as that of general graphite, and it can be processed using grinding wheels and milling machines. It is also possible to process and deliver it in the specified shape within the designated size. Prototypes can be made from a single piece. For details, we will propose the optimal heat dissipation material after consultation. Applications: Heat transfer in the thickness direction for high-output devices such as inverters (thickness of 2 mm or more), heat dissipation plates for thermal diffusion requiring a thickness of 1 mm or more, and other heat dissipation plates requiring thickness for smartphones, laptops, tablets, etc.

  • Other polymer materials

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